Gelid TP-GP04-RA Reusable Thermal Patch
Gelid TP-GP04-RA Reusable Thermal Patch
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The Gelid TP-GP04-RA reusable thermal patch is designed to provide a reliable and durable solution for optimizing the thermal management of electronic and computer components. Thanks to its high thermal conductivity, it promotes the efficient transfer of heat generated by processors, chips, and memory modules, helping to maintain system stability and performance. Its reusable design allows for multiple applications without altering its properties, making it ideal for frequent maintenance or adjustment operations, while ensuring the safety of sensitive components.
- Reusable thermal patch suitable for electronic and computer devices.
- High thermal conductivity to improve heat dissipation.
- Helps maintain optimal performance of processors, chips and memory modules.
- Suitable for multiple applications without loss of thermal performance.
- Good adhesion for efficient and even contact with surfaces.
- Available in gray and blue.
Place the Gelid TP-GP04-RA thermal patch between the heat source (such as a processor or memory module) and the heat sink, ensuring that the contact surfaces are clean and dry. Apply moderate pressure to ensure even adhesion and optimal heat transfer. This patch can be removed and reused during maintenance or component replacement operations, taking care to preserve its integrity. Refer to the package insert for detailed instructions and precautions for use.
Silicone, thermally conductive fillers, colorants. For the full list of ingredients, see package insert.
